PCF8811U/2DA/1 NXP [NXP Semiconductors], PCF8811U/2DA/1 Datasheet - Page 6

• Manufacturer Part Number: PCF8811U/2DA/1
• Description: 80 x 128 pixels matrix LCD driver
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Table 5.
All x/y coordinates represent the position of the center of each pad with respect to the center (x/y = 0) of the chip; see
Figure
PCF8811_4
Product data sheet
Symbol
-
-
-
-
-
-
-
-
MF2
MF1
MF0
DS0
OSC
EXT
PS0
PS1
PS2
V
SS(tie-off)
2.
Bonding pad description
6.2 Pin description
Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Table 3.
[1]
[2]
Table 4.
[1]
Pad
Pad pitch
Pad size (aluminium)
Bump dimensions
Wafer thickness (excluding
bumps)
Die size X
Die size Y
Pad
2
108
Fabrication 1 identification starts with nnnnnn, where n represents a number between 0 and 9.
Fabrication 2 identification starts with AXnnnn, where X represents a letter and n represents a number
between 0 and 9.
For the position of each pad, see
X ( m)
6092.00
5995.00
5876.00
5822.00
5768.00
5714.00
5660.00
5390.00
5012.00
4850.00
4688.00
4526.00
4364.00
4094.00
3932.00
3770.00
3608.00
3446.00
Bonding pad and chip dimensions
Alignment marker position
Y ( m)
1030.00
1017.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
1030.00
Rev. 04 — 27 June 2008
Row/Column side ( m)
51.84 min
42.84
29.9
381 ( 25)
Fab 1 (mm)
12.45
2.31
X ( m)
5995
Table
5904
Description
dummy_slanted
alignment mark
dummy
dummy
dummy
dummy
dummy
dummy
manufacturer device ID input
manufacturer device ID input
manufacturer device ID input
device recognition input
oscillator input
extended command set input
parallel/serial/I
parallel/serial/I
parallel/serial/I
-
5.
98.5 ( 3)
[1]
105
[1]
2
2
2
C-bus data selection input
C-bus data selection input
C-bus data selection input
80 x 128 pixels matrix LCD driver
Interface side ( m)
54.0 min
50
32.2
Fab 2 (mm)
12.41
2.27
Y ( m)
1017
1017
100
93.5 ( 3)
PCF8811
© NXP B.V. 2008. All rights reserved.
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