AD9148BPCZ AD [Analog Devices], AD9148BPCZ Datasheet - Page 8

• Manufacturer Part Number: AD9148BPCZ
• Description: Quad 16-Bit,1 GSPS, TxDAC+ Digital-to-Analog Converter
• Manufacturer: AD [Analog Devices]

AD9148
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33, IOVDD
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
OUT3_P, OUT3_N,
OUT4_P, OUT4_N
A15_P to A0_P,
A15_N to A0_N,
B15_P to B0_P,
B15_N, B0_N
DCIA_P, DCIA_N,
FRAMEA_P, FRAMEA_N,
DCIB_P, DCIB_N,
FRAMEB_P, FRAMEB_N
CLK_P, CLK_N,
REFCLK_P, REFCLK_N
CSB, SCLK, SDIO, SDO,
TDO, TDI, TCK, TMS,
RESET
Junction Temperature
Storage Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Typical θ
still air for each package offering Airflow increases heat dissipation
effectively reducing θ
Range
, IRQ
E
JA
, θ
, PLL_LOCK
E
JB
, and θ
JC
JA
are specified vs. the number of PCB layers in
and θ
With
Respect To
AGND,
DGND,
CGND
AGND,
DGND,
CGND
DGND,
CGND
AGND,
CGND
AGND,
DGND
AGND
AGND
DGND
DGND
CGND
DGND
JB
.
Rating
−0.3 V to +3.6 V
−0.3 V to +2.10 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to DVDD18+ 0.3 V
−0.3 V to CVDD18 + 0.3
V
−0.3 V to IOVDD + 0.3 V
125°C
−65°C to +150°C
Rev. PrA | Page 8 of 73
Table 7. Thermal Resistance
Package Type
196-Ball CSP_BGA
196-Ball BGA_EP
MAXIMUM SAFE POWER DISSIPATION
The maximum junction temperature for the AD9148 is 125°C.
With the thermal resistance of the molded package (CSP_BGA)
given for a 12 layer board, the maximum power that can be
dissipated in this package can be calculated as
To increase the maximum power, the AD9148 is available in a
second package option (BGA_EP) which includes a heat spreader
on top of the package. Also, an external heat sink can be
attached to the top of the AD9148 CSP_BGA package. The
adjusted maximum power for each of these conditions is shown in
Table 8.
With the thermal resistance of the heat spreader package
(BGA_EP) given for a 12 layer board, the maximum power that
can be dissipated in this package can be calculated as
To increase the maximum power, an external heat sink can be
attached to the top of the AD9148 BGA_EP package. The
adjusted maximum power for an external heat sink is shown in
Table 8.
To aid in the selection of package, the maximum f
power dissipation over several operating conditions is shown in
Table 9. The maximum f
Note that if the programmable inverse sinc filter is enabled the
maximum f
ESD CAUTION
Power
Power
MAX
MAX
DAC
rate specified in Table 9 decreases.
=
=
(
(
T
T
J
J
Preliminary Technical Data
θ
θ
−
−
JA
JA
θ
24.7
19.2
18.1
18.0
20.9
16.2
15.2
15.0
T
T
DAC
JA
A
A
)
)
rate applies to all interpolation rates.
=
=
(
(
θ
12.6
10.9
10.5
10.5
8.6
7.7
7.4
7.4
125
125
JB
18
15
−
−
0 .
0 .
85
85
θ
5.7
5.3
5.3
5.3
3.1
3.1
3.1
3.1
JC
)
)
=
=
. 2
. 2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
22
67
W
W
DAC
rate for a given
Notes
4-layer board,
25 PCB vias
8-layer board,
25 PCB vias
10-layer board,
25 PCB vias
12-layer board,
25 PCB vias
4-layer board,
25 PCB vias
8-layer board,
25 PCB vias
10-layer board,
25 PCB vias
12-layer board,
25 PCB vias