MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 22

• Manufacturer Part Number: MPC8536DS
• Description: BOARD DEV SYSTEM MPC8536E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8536DS

• Contents: Board, Software and Documentation
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Operating Supply Voltage: - 0.3 V to + 1.21 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Interface Type: SPI, USB
• Program Memory Type: DDR2, DDR3, SDRAM
• Core Size: 32 Bit
• Program Memory Size: 544KB
• Cpu Speed: 1.5GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 0.95V To 1.05V
• Rohs Compliant: Yes
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Core supply voltage
Platform supply voltage
PLL core supply voltage
PLL other supply voltage
Overall DC Electrical Characteristics
2.1.2
Table 3
and tested operating conditions. Proper device operation outside these conditions is not guaranteed.
22
Pad power supply for SerDes transceivers and PCI Express
DDR SDRAM
Controller I/O
supply voltage
Three-speed Ethernet I/O, MII management voltage
PCI, DUART, system control and power management, I
eSDHC, eSPI and JTAG I/O voltage
Local bus I/O voltage
Input voltage
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in
2. The 3.63-V maximum is only supported when the port is configured in GMII, MII, RMII or TBI modes; otherwise the 2.75V
3. (M,L,O)V
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
maximum applies. See
the recommended operating conditions per protocol.
provides the recommended operating conditions for this device. Note that the values in
IN
Recommended Operating Conditions
and MV
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
DDR2 SDRAM Interface
DDR3 SDRAM Interface
DDR2/DDR3 DRAM signals
DDR2/DDR3 DRAM reference
Three-speed Ethernet signals
Local bus signals
PCI, DUART, SYSCLK, system control and
power management, I
REF
Section 2.9.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing
Characteristic
may overshoot/undershoot to a voltage and for a maximum duration as shown in
Characteristic
Table 2. Absolute Maximum Ratings
Table 3. Recommended Operating Conditions
2
C, and JTAG signals
2
C, USB,
Table
3. Absolute maximum ratings are stress ratings only, and
TV
LV
XV
DD
DD
Symbol
DD,
MV
GV
OV
BV
AV
MV
T
BV
OV
TV
(eTSEC1)
LV
(eTSEC3)
V
1
V
STG
Symbol
DD_CORE
X2V
REF
DD_PLAT
(continued)
DD_CORE
DD
DD
DD
IN
AV
IN
IN
IN
IN
DD
DD
Recommended Value Unit Notes
–0.3 to (GV
–0.3 to (GV
–0.3 to (BV
–0.3 to (OV
–0.3 to (TV
–0.3 to (LV
–0.3 to 1.98
–0.3 to 1.65
–0.3 to 3.63
–0.3 to 2.75
–0.3 to 3.63
–0.3 to 2.75
–0.3 to 3.63
–0.3 to 3.63
–0.3 to 2.75
–0.3 to 1.98
1.0 ± 50 mV
1.1 ± 55 mV
1.0 ± 50 mV
1.0 ± 50 mV
1.1 ± 55 mV
1.0 ± 50 mV
Max Value
–0.3 to 1.1
–55 to 150
Table 2
Specifications,” for details on
Freescale Semiconductor
DD
DD
DD
DD
DD
DD
are the recommended
+ 0.3)
+ 0.3)
+ 0.3)
+ 0.3)
+ 0.3)
+ 0.3)
Figure
Unit Notes
0
—
V
V
V
V
V
V
V
V
V
V
2.
C
V
V
V
V
—
—
—
—
—
—
—
2
2
3
3
3
1,2
—
1
2