MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 28

BOARD DEV SYSTEM MPC8536E

MPC8536DS

Manufacturer Part Number
MPC8536DS
Description
BOARD DEV SYSTEM MPC8536E
Manufacturer
Freescale Semiconductor
Series
PowerQUICC III™r
Type
MPUr
Datasheets

Specifications of MPC8536DS

Contents
Board, Software and Documentation
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Operating Supply Voltage
- 0.3 V to + 1.21 V
Maximum Operating Temperature
+ 105 C
Data Ram Size
32 KB
Interface Type
SPI, USB
Program Memory Type
DDR2, DDR3, SDRAM
Core Size
32 Bit
Program Memory Size
544KB
Cpu Speed
1.5GHz
Digital Ic Case Style
BGA
No. Of Pins
783
Supply Voltage Range
0.95V To 1.05V
Rohs Compliant
Yes
For Use With/related Products
MPC8536
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Maximum (A)
Thermal (W)
Typical (W)
Doze (W)
Nap (W)
Sleep (W)
Deep Sleep
(W)
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
2. Typical power is an average value measured at the nominal recommended core voltage (V
3. Maximum power is the maximum power measured with the worst process and recommended core and platform voltage (V
4. Thermal power is the maximum power measured with worst case process and recommended core and platform voltage (V
5. VDD Core = 1.0 V for 600 to 1333 MHz, 1.1 V for 1500 MHz.
6. Maximum power is the maximum number measured with USB1, eTSEC1, and DDR blocks enabled. The Mean power is the
7. Mean power is provided for information purposes only and is the mean power consumed by a statistically significant range of
8. Maximum operating junction temperature (see
9. Platform power is the power supplied to all the
Power Characteristics
See
supports.
28
Power Mode
configurations. The values do not include power dissipation for I/O supplies.
(see
at maximum operating junction temperature (see
L1-cache-resident, contrived sequence of instructions which keep the execution unit maximally busy.
at maximum operating junction temperature (see
mean power measured with only external interrupts enabled and DDR in self refresh.
devices.
Section 2.23.6.1, “SYSCLK to Platform Frequency
Table
3) while running the Dhrystone benchmark.
Frequen
(MHz)
Core
1500
cy
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Frequen
(MHz)
CCB
500
cy
Table 5. MPC8536E Power Dissipation (continued)
Frequen
(MHz)
DDR
667
cy
Platfor
V
1.0
(V)
m
DD
Table
V
DD_PLAT
Table
Table
3) for Commercial Tier is 90
Core
Options,” for the full range of CCB frequencies that MPC8536E
V
1.1
(V)
3) while running a smoke test which includes an entirely
3) while running the Dhrystone benchmark.
DD
pins.
5
Junction
Tempera
ture
(°C)
105
/ 90
65
35
mean
3.0
2.2
1.1
1.1
Core Power
0
7
0
C, for Industrial Tier is 105
7.1/6.1
5.9/4.9
Max
3.3
2.1
2.1
0
DD
5
) and 65°C junction temperature
mean
Platform Power
1.7
1.5
1.5
1.1
0.6
Freescale Semiconductor
7
5.0/4.0
5.0/4.0
Max
2.1
2.1
1.7
1.2
0
C.
9
Notes
1, 3, 8
1, 4, 8
1, 2
1, 6
1
1
1
DD
DD
)
)

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