S9S08DZ60F1MLH Freescale Semiconductor, S9S08DZ60F1MLH Datasheet - Page 123

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S9S08DZ60F1MLH

Manufacturer Part Number
S9S08DZ60F1MLH
Description
MCU 60K FLASH MASK AUTO 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of S9S08DZ60F1MLH

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LQFP
Processor Series
S08D
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 7 Central Processor Unit (S08CPUV3)
7.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active background
mode rather than continuing the user program.
MC9S08DZ60 Series Data Sheet, Rev. 4
Freescale Semiconductor
123

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