S9S08DZ60F1MLH Freescale Semiconductor, S9S08DZ60F1MLH Datasheet - Page 146

• Manufacturer Part Number: S9S08DZ60F1MLH
• Description: MCU 60K FLASH MASK AUTO 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08DZ60F1MLH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Processor Series: S08D
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 8
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

IREFS=1
CLKS=01
PLLS=0
BDM Disabled
and LP=1
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
8.4
8.4.1
146
Functional Description
Operational Modes
Internal (BLPI)
Low Power
Entered from any state
when MCU enters stop
Bypassed
BDM Enabled
or LP=0
IREFS=1
CLKS=00
PLLS=0
IREFS=1
CLKS=01
PLLS=0
FLL Engaged
Internal (FEI)
FLL Bypassed
Internal (FBI)
MC9S08DZ60 Series Data Sheet, Rev. 4
Figure 8-8. Clock Switching Modes
Stop
FLL Engaged
External (FEE)
PLL Bypassed
External (PBE)
FLL Bypassed
External (FBE)
PLL Engaged
External (PEE)
Returns to state that was active
before MCU entered stop, unless
RESET occurs while in stop.
IREFS=0
CLKS=00
PLLS=0
BDM Enabled
or LP=0
BDM Enabled
or LP=0
IREFS=0
CLKS=10
PLLS=0
IREFS=0
CLKS=10
PLLS=1
IREFS=0
CLKS=00
PLLS=1
External (BLPE)
Low Power
Bypassed
Freescale Semiconductor
IREFS=0
CLKS=10
BDM Disabled
and LP=1