S9S08DZ60F1MLH Freescale Semiconductor, S9S08DZ60F1MLH Datasheet - Page 6

• Manufacturer Part Number: S9S08DZ60F1MLH
• Description: MCU 60K FLASH MASK AUTO 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08DZ60F1MLH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Processor Series: S08D
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 8
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document.
© Freescale Semiconductor, Inc., 2007-2008. All rights reserved.
This product incorporates SuperFlash
6
Revision
http://freescale.com/
Number
1
2
3
4
Revision
10/2007
6/2006
9/2007
6/2008
Date
Advance Information for alpha samples customers
Product Launch. Removed the 64-pin QFN package. Changed from standard to extended
mode for MSCAN registers in register summary. Corrected Block diagrams for SCI.
Updated the latest Temp Sensor information. Made FTSTMOD reserved. Updated device
to use the ADC 12-bit module. Revised the MCG module. Updated the CPU Instruction Set
table. Updated the TPM block module to version 3. Added the TPM block module version
2 as an appendix for devices using 3M05C (or earlier) mask sets. Heavily revised the
Electricals appendix.
Removed two tables that were inadvertently included in the MC9S08DZ60 version of the
book.
Sustaining update. Incorporated PS Issues # 2765, 3177, 3236, 3292, 3311, 3312, 3326,
3335, 3345, 3382, 2795, 3382 and 3386 PLL Jitter Spec update. Also, added internal
reference clock trim adjustment statement to Features page. Updated the TPM module to
the latest version. Adjusted values in Table A-13 Control Timing row 2 and in Table A-6 DC
Characteristics row 24 so that it references 5.0 V instead of 3.0 V.
®
Technology licensed from SST.
MC9S08DZ60 Series Data Sheet, Rev. 4
Description of Changes
Freescale Semiconductor