MC13224V Freescale Semiconductor, MC13224V Datasheet - Page 9

ZIGBEE PLATFORM 802.15.4 145-LGA

MC13224V

Manufacturer Part Number
MC13224V
Description
ZIGBEE PLATFORM 802.15.4 145-LGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC13224V

Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4 Zigbee
Applications
General Purpose
Power - Output
4dBm
Sensitivity
-100dBm
Voltage - Supply
2 V ~ 3.6 V
Current - Receiving
24mA
Current - Transmitting
29mA
Data Interface
PCB, Surface Mount
Memory Size
128kB Flash, 96kB RAM
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 105°C
Package / Case
145-LGA
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
2.4 GHz
Interface Type
4-Wire SPI, I2C
Output Power
1.5 dBm
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Maximum Supply Current
31 mA
Minimum Operating Temperature
- 40 C
Modulation
OQPSK
Protocol Supported
802.15.4
No. Of Pins
99
Supply Voltage Range
2V To 3.6V
Operating Temperature Range
-40°C To +125°C
Msl
MSL 3 - 168 Hours
A/d Converter
12 Bits
No. Of Timers 8/12/16/32 Bits
0 / 0 / 4 / 0
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC13224V
Manufacturer:
Freescale Semiconductor
Quantity:
1 849
Part Number:
MC13224VR2
Manufacturer:
EPCOS
Quantity:
34 000
BeeStack uses the IEEE 802.15.4-compatible MAC/PHY layer that is not part of ZigBee itself. The NWK
layer defines routing, network creation and configuration, and device synchronization. The application
framework (AF) supports a rich array of services that define ZigBee functionality. ZigBee Device Objects
(ZDO) implement application-level services in all nodes via profiles. A security service provider (SSP) is
available to the layers that use encryption (NWK and APS), i.e., Advanced Encryption Standard (AES)
128-bit security.
The complete Freescale BeeStack protocol stack includes the following components:
In addition to the use of two Stack Profiles, ZigBee also embraces the concept of application profiles. The
profiles are intended to assure interoperability between like devices for a specific application from
different vendors. The application profile specifies a device description and its messaging protocol such
that it defines the type, shape, and features of the network. The ZigBee Alliance defines each profile and
targets a specific market. Examples include Smart Energy, Home Automation, Health Care, and Remote
Control.
Freescale’s BeeStack supports a number of these application profiles through demonstration software
projects. These projects can be used as a starting point for the user to develop their specific application.
For more information on Freescale supported application profiles see AN3403, Freescale IEEE
802.15.4/ZigBee Software Selector Guide.
2.3.4.2
When using the BeeStack codebases on the MC1322x platform, the application should be targeted to the
proper part number:
BeeStack for the MC1322x platform is a single codebase, device selection is determined by a
configuration wizard when the BeeKit project is first developed.
2.3.4.3
In response to significant market opportunity in the consumer electronics remote control market, the
ZigBee Alliance adapted the ZigBee RF4CE Specification in 2009. Freescale’s BeeStack Consumer stack
implements the ZigBee RF4CE protocol. It is also a networking layer that sits on top of the IEEE
Freescale Semiconductor
ZigBee Device Objects (ZDO) and ZigBee Device Profile (ZDP)
Application Support Sub-Layer (APS)
Application Framework (AF)
Network (NWK) Layer
Security Service Provider (SSP)
IEEE 802.15.4-compatible MAC and Physical (PHY) Layer
MC13224V should be used for ZigBee Profile 1 applications
MC13226V should be used for ZigBee Profile 2 (Pro) applications
Using BeeStack on the MC1322x Platform
BeeStack Consumer
For more details on the ZigBee model and protocol, the user is directed to
the ZigBee Specification at www.zigbee.org.
MC1322x Technical Data, Rev. 1.3
NOTE
®
9

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