AD9553/PCBZ Analog Devices Inc, AD9553/PCBZ Datasheet - Page 29

• Manufacturer Part Number: AD9553/PCBZ
• Description: Clock Translator Eval. Board
• Manufacturer: Analog Devices Inc

Specifications of AD9553/PCBZ

• Silicon Manufacturer: Analog Devices
• Silicon Core Number: AD9553
• Kit Application Type: Clock & Timing
• Application Sub Type: Clock Translator
• Peak Reflow Compatible (260 C): Yes
• Msl: MSL 3 - 168 Hours
• Rohs Compliant: Yes
• Development Tool Type: Hardware - Eval/Demo Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

APPLICATIONS INFORMATION
THERMAL PERFORMANCE
The AD9553 is specified for case temperature (T
that T
equation to determine the junction temperature on the applica-
tion printed circuit board (PCB):
where:
T
T
at the top center of the package.
Ψ
P
parameters).
Table 23. Thermal Parameters for the 32-Lead LFCSP Package
Symbol
θ
θ
θ
θ
Ψ
θ
Ψ
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine whether they are similar to those assumed in these calculations.
JA
JMA
JMA
JB
JC
J
CASE
D
JB
JT
JT
is the junction temperature (°C).
is the power dissipation (see Table 1 for the power consumption
is the value indicated in Table 23.
T
is the case temperature (°C) measured by the customer
CASE
J
= T
is not exceeded, use an airflow source. Use the following
CASE
Description
Junction-to-ambient thermal resistance, 0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, 0 m/sec airflow per JEDEC JESD51-8 (still air)
Junction-to-board characterization parameter, 0 m/sec airflow per JEDEC JESD51-6 (still air)
Junction-to-case thermal resistance
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× P
D
)
CASE
). To ensure
Rev. A | Page 29 of 44
Values of θ
considerations. θ
of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of θ
design considerations.
J
T
using the following equation:
J
= T
A
is the ambient temperature (°C).
JA
A
JC
JB
are provided for package comparison and PCB design
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
JA
× P
can be used for a first-order approximation
D
)
Value
41.6
36.4
32.6
24.2
22.9
4.8
0.5
AD9553
1
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W