LFE2M20E-6FN484C LATTICE SEMICONDUCTOR, LFE2M20E-6FN484C Datasheet - Page 46

• Manufacturer Part Number: LFE2M20E-6FN484C
• Description: FPGA LatticeECP2M Family 19000 Cells 90nm (CMOS) Technology 1.2V 484-Pin FBGA
• Manufacturer: LATTICE SEMICONDUCTOR

Specifications of LFE2M20E-6FN484C

• Package: 484FBGA
• Family Name: LatticeECP2M
• Device Logic Units: 19000
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 304
• Ram Bits: 1246208

Lattice Semiconductor
3. Left and Right (Banks 2, 3, 6 and 7) sysI/O Buffer Pairs (50% Differential and 100% Single-Ended Out-
4. Bank 8 sysI/O Buffer Pairs (Single-Ended Outputs, Only on Shared Pins When Not Used by Configura-
In LatticeECP2 devices, only the I/Os on the bottom banks have programmable PCI clamps. In LatticeECP2M
devices, the I/Os on the left and bottom banks have programmable PCI clamps.
Typical sysI/O I/O Behavior During Power-up
The internal power-on-reset (POR) signal is deactivated when V
levels. After the POR signal is deactivated, the FPGA core logic becomes active. It is the user’s responsibility to
ensure that all other V
all the I/O banks that are critical to the application. For more information about controlling the output logic state with
valid input logic levels during power-up in LatticeECP2/M devices, see the list of additional technical documentation
at the end of this data sheet.
The V
fers. In order to simplify system design while providing consistent and predictable I/O behavior, it is recommended
that the I/O buffers be powered-up prior to the FPGA core fabric. V
together with the V
Prior to and throughout programming of the FPGA, the I/O of the device have a weak-pullup resistor to V
the input buffer and the output buffer is tri-stated. A pullup to V
the input differently in the FPGA design. See the
value will be between 20-30K ohms based on the V
active if the design does not use a particular I/O.
Supported sysI/O Standards
The LatticeECP2/M sysI/O buffer supports both single-ended and differential standards. Single-ended standards
can be further subdivided into LVCMOS, LVTTL and other standards. The buffers support the LVTTL, LVCMOS
1.2V, 1.5V, 1.8V, 2.5V and 3.3V standards. In the LVCMOS and LVTTL modes, the buffer has individual configura-
tion options for drive strength, bus maintenance (weak pull-up, weak pull-down, or a bus-keeper latch) and open
drain. Other single-ended standards supported include SSTL and HSTL. Differential standards supported include
LVDS, MLVDS, BLVDS, LVPECL, RSDS, differential SSTL and differential HSTL. Tables 2-13 and 2-14 show the I/
sets of single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also
be configured as a differential input. 

The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
puts)
The sysI/O buffer pairs in the left and right banks of the device consist of two single-ended output drivers, two
sets of single-ended input buffers (both ratioed and referenced) and one differential output driver. One of the ref-
erenced input buffers can also be configured as a differential input. In these banks the two pads in the pair are
described as “true” and “comp”, where the true pad is associated with the positive side of the differential I/O, and
the comp (complementary) pad is associated with the negative side of the differential I/O. 

LVDS differential output drivers are available on 50% of the buffer pairs on the left and right banks.
tion)
The sysI/O buffers in Bank 8 consist of single-ended output drivers and single-ended input buffers (both ratioed
and referenced). The referenced input buffer can also be configured as a differential input. 

The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of the
differential input buffer.
CC
and V
CCAUX
CC
CCIO
supply the power to the FPGA core fabric, whereas the V
and V
banks are active with valid input logic levels to properly control the output logic states of
CCAUX
supplies.
DC Electrical Characteristics
CCIO
2-43
voltage supplied on the board. This pullup will also remain
CCIO
CC
, V
CCIO
is present on the input until the user programs
CCIO8
LatticeECP2/M Family Data Sheet
supplies should be powered-up before or
and V
table of this data sheet. The pullup
CCIO
CCAUX
supplies power to the I/O buf-
have reached satisfactory
Architecture
CCIO
on