A80960JF3V25 Intel, A80960JF3V25 Datasheet - Page 64

• Manufacturer Part Number: A80960JF3V25
• Description: IC MPU I960JF 3.3V 25MHZ 132-PGA
• Manufacturer: Intel

Specifications of A80960JF3V25

• Processor Type: i960
• Features: JF suffix, 32-Bit, 4K Cache
• Speed: 25MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 132-PGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 819540

80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor
64
Table 33. 132-Lead PGA Package Thermal Characteristics
Table 34. 80960JA/JF/JD 196-Ball MPBGA Package Thermal Characteristics
NOTES:
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2.
3.
4.
5.
6.
7.
8.
1. This table applies to an MPBGA device soldered directly into a board with all V
2.
JC
CA
CA
CA
JC
CA
(Junction-to-Case)
(Case-to-Ambient) (Omnidirectional Heatsink)
(Case-to-Ambient) (Unidirectional Heatsink)
(Junction-to-Case)
(Case-to-Ambient) (No Heatsink)
(Case-to-Ambient) (No Heatsink)
JA
J-CAP
J-PIN
J-PIN
J-CAP
J-PIN
J-PIN
JA
=
=
= 6.4° C/W (inner pins) (approximate) (no heatsink)
= 6.2° C/W (outer pins) (approximate) (no heatsink)
= 3.3° C/W (inner pins) (approximate) (with heatsink)
= 3.3° C/W (outer pins) (approximate) (with heatsink)
JC
JC
= 5.6° C/W (approximate) (no heatsink)
= 3° C/W (approximate) (with heatsink)
+
+
CA
CA
Parameter
Parameter
J-PIN
Thermal Resistance — °C/Watt
Thermal Resistance — °C/Watt
JA
JA
0.7
(0)
(0)
25
15
16
30
0
0
2
JC
JC
(1.01)
(1.01)
200
200
0.7
19
22
9
8
2
CA
Airflow — ft./min (m/sec)
Airflow — ft./min (m/sec)
CA
J-CAP
(2.03)
(2.03)
400
400
0.7
14
20
6
6
2
SS
(3.04)
(3.04)
600
600
0.7
12
19
5
5
2
connections.
(4.06)
(4.06)
800
800
0.7
11
18
4
4
2
Datasheet
(5.08)
(5.08)
1000
1000
0.7
10
18
4
4
2