PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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Preface
As a type of isolator favored by manufacturers, photocouplers
now serve as noise protectors in many electronic devices.
Toshiba’s photocouplers consist of either a GaAs or GaA As
infrared LED(s) and a silicon photodetector(s) housed in a mold
package. GaA As LEDs are adopted in high-speed photo-IC
types due to their high-speed and high-light output.
Perspective view
Cross section
of the TLP521-1
of the TLP521-1
C O N T E N T S
1. Product Index ............................................................... 3
2. New Products .............................................................. 5
3. Photocoupler Product Tree .......................................... 9
4. Selection Guide ......................................................... 10
1
.
Transistor-Output and Darlington-Transistor-
............................................... 10
Output Photocouplers
2. Photocouplers for Logic Signal Transmission
3. Photocouplers for IGBT/MOSFET Gate Drive
.................... 26
4. Photorelays (1-Form-A and 2-Form-A)
5. Photorelays
(1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
...................................... 34
6. Triac-Output Photocouplers
................................ 37
7. Thyristor-Output Photocouplers
.......................... 38
8. Photovoltaic-Output photocouplers
9. Products Manufactured by Toshiba Semiconductor
......................................... 38
(Thailand) Co., Ltd. (TST)
5. Part Naming Conventions .......................................... 41
Extensive Line of Products
To meet customers’ various needs, we offer an extensive
product portfolio shown below as well as general-
purpose photocouplers.
1. Photo-IC couplers: High speed and advanced functions
(highly integrated detectors)
2. Zero-crossing phototriac couplers: Phototriac-output
devices with zero-crossing detection
3. Photovoltaic couplers: MOSFET gate drive (high voltage
White overmold
(epoxy)
output achieved using a photodiode array)
Detector
4. Photorelays (MOSFET-output devices):
Dome (silicon)
AC-DC switches (MOSFET output)
Infrared LED
Mechanical relay replacement
Lead frame
Safety Standard Approvals
UL approval has been obtained under file number E67349 for
most of our photocouplers. EN60747-5-2-approved
photocouplers are also offered with a wide selection of output
(transistor, thyristor, triac, IC output and photorelay). The
designs of these devices meet other standards including
IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065.
Small-Package Products
Toshiba offers a wide variety of photocouplers in a small
package to meet the space-saving requirement of increasingly
smaller and thinner end products. Packaging options include
mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat
SOP packages.
Overseas Manufactured Photocouplers
Part of the general-purpose photocouplers with transistor and
triac outputs are manufactured by Toshiba Semiconductor
Thailand Co., Ltd. This will help customers procure components
locally for overseas assembly of end products.
6. Package Information .................................................. 42
1
.
Lead Form Options for DIP Packages
................................................. 43
2
Package Dimensions
.
Rank Marking .........................................................
3
.
7. Packing Information ................................................... 50
1
Photocoupler Magazine Packing
.
.......... 17
............................................................. 51
Specifications
........ 23
2
Tape-and-Reel Specifications
.
8. Board Assembly ......................................................... 56
Example Land Patterns ..........................................
1
.
...... 32
2
Board Assembly Considerations
.
9. Device Degradation ................................................... 58
1
Projected Operating Life Based on LED Light
.
................................................... 58
Output Degradation
10. Safety Standard Approvals ...................................... 65
11. Photocoupler Application Circuit Examples ............. 67
12. Competitor Cross Reference ................................... 79
2
..................... 42
49
................................... 53
56
.............................. 57