PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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4
Selection Guide
MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package (Continued)
Part Number
Pin Configuration
DIP8
8
7
6
5
TLP227G-2
Dual-channel version of the TLP227G
SEMKO-approved
DIP8
TLP227GA-2
Dual-channel version of the TLP227GA
1
2
3
4
SEMKO-approved
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
TÜV and VDE: : Approved
: Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
5
Photorelays (1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
Package
Features
Off-State
On-State
On-State
Voltage
Resistance
Current
2.54SOP4
(max)
(max)
(max)
(V)
(Ω)
(A)
50
0.09
TLP4172G
50
0.10
350
25
0.12
TLP4176G
25
0.15
50
0.09
350
50
0.10
25
0.12
* Dual-channel
MOSFET-Output Photorelays, 1-Form-B
Part Number
Pin Configuration
4
3
2.54SOP4
TLP4172G
Lead pitch: 2.54 mm
1-Form-B
1
2
6
5
4
2.54SOP6
TLP4192G
Lead pitch: 2.54 mm
1-Form-B
1
2
3
4
3
DIP4
TLP4222G
1-Form-B
1
2
6
5
4
DIP6
TLP4592G
1-Form-B
1
2
3
4
3
2.54SOP4
TLP4176G
Lead pitch: 2.54 mm
1-Form-B
1
2
6
5
4
2.54SOP6
TLP4197G
Lead pitch: 2.54 mm
1-Form-B
1
2
3
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
TÜV and VDE: : Approved
: Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
R
(Max)
I
ON
FT
Features
(Max)
@I
F
3
mA
35
Ω
5
mA
3
mA
35
Ω
5
mA
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
2.54SOP6
2.54SOP8
TLP4192G
TLP4202G*
TLP4197G
TLP4206G*
TLP4027G*
TLP4026G*
R
(Max)
I
ON
FT
Features
(Max)
@I
F
3
50
0
mA
Ω
mA
3
50
0
mA
Ω
mA
3
50
0
mA
Ω
mA
3
50
0
mA
Ω
mA
3
25
0
mA
Ω
mA
3
25
Ω
0
mA
mA
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
32
(2)
Safety Standards
I
ON
V
BVs
OFF
(Max)
UL/cUL TÜV
VDE
BSI
2500
0.12
A
350
/
V
Vrms
2500
0.12
A
400
/ –
V
Vrms
DIP4
DIP6
DIP8
TLP4222G
TLP4592G
TLP4222G-2*
TLP4227G
TLP4597G
TLP4227G-2*
TLP4007G*
TLP4006G*
(2)
Safety Standards
I
ON
V
BVs
OFF
(Max)
UL/cUL TÜV
VDE
BSI
1500
0.09
350
A
V
/ –
Vrms
1500
0.09
A
350
/ –
V
Vrms
2500
0.1
350
A
V
/ –
Vrms
2500
0.1
350
A
V
/ –
Vrms
1500
0.12
A
350
/ –
V
Vrms
1500
0.12
A
350
/ –
V
Vrms
IEC
IEC