PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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6
Package Information
1
Lead Form Options for DIP Packages
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Lead Form
Appearance
Lead Form Code
Carrier Tape Code
Package Outlines
Example 1: Standard part: TLP620(F)
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
See the TLP781, TLP785 datasheet.
Surface-Mount
(LF1)
(LF4)
(TP1)
(TP4)
4-pin DIP
8-pin DIP
4 3
8
5
1
2
1
4
B
6-pin DIP
16-pin DIP
6
5
4
16
9
1 2
3
1
8
Dimensions
Version
(LF1)
(LF4)
Min
Max
Min
Max
Dimension
A
10.0
12.0
B
(0.35 typ.)
(0.25 typ.)
C
6.4
8.0
All other package dimensions are the same as for each standard package
specification.
42
Wide-Spaced
(LF5)
(LF2)
(TP5)
Not available*
10.16
A
C
10 to 12
Unit: mm
(LF5)
Min
Max
10.0
0.2
6.4
* Tape-and-reel packing is not available with (LF2).