PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 304

• Manufacturer Part Number: PIC24HJ64GP502-E/MM
• Description: IC PIC MCU FLASH 64K 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit or 10-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FIGURE 28-11:
TABLE 28-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70293D-page 304
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
Note: Refer to Figure 28-1 for load conditions.
2:
3:
SCK
(CKP = 0)
(CKP = 1)
SDO
SS
SCK
SDI
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ SSx
X
TscH2ssH
TscL2ssH
X
Symbol
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
X
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx
High-Impedance
SSx after SCKx Edge
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
to SCKx
to SDOx Output
Characteristic
SP35
SP71
SP40
(3)
MSb In
or SCKx Input
MSb
SP41
SP70
(3)
(3)
(1)
SP30,SP31
Preliminary
(3)
(3)
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
1.5 T
Bit 14 - - - - - -1
Min
120
30
30
20
20
10
—
—
—
—
—
CY
+40
SP73
SP72
Typ
—
—
10
10
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb In
Max
—
—
25
25
30
50
—
—
—
—
—
—
-40°C
-40°C
SP52
© 2009 Microchip Technology Inc.
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
T
T
A
A
See Note 3
See Note 3
See parameter D032
and Note 3
See parameter D031
and Note 3
See Note 3
+85°C for Industrial
+125°C for Extended
Conditions
—
—
—
—
—
—
—