PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 305

• Manufacturer Part Number: PIC24HJ64GP502-E/MM
• Description: IC PIC MCU FLASH 64K 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit or 10-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FIGURE 28-12:
© 2009 Microchip Technology Inc.
Note: Refer to Figure 28-1 for load conditions.
SCKx
(CKP = 0)
(CKP = 1)
SDOx
SDI
SDIx
SSx
SCKx
SP60
SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP50
SP40
MSb In
SP71
SP41
MSb
SP30,SP31
SP70
Bit 14 - - - - - -1
Bit 14 - - - -1
Preliminary
SP35
SP73
SP72
LSb
LSb In
SP72
SP73
SP52
SP51
DS70293D-page 305