PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 323

IC PIC MCU FLASH 64K 28-QFN

PIC24HJ64GP502-E/MM

Manufacturer Part Number
PIC24HJ64GP502-E/MM
Description
IC PIC MCU FLASH 64K 28-QFN
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

Program Memory Type
FLASH
Program Memory Size
64KB (22K x 24)
Package / Case
28-QFN
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit or 10-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
29.0
This section provides an overview of PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 and PIC24HJ128GPX02/X04
electrical characteristics for devices operating in an ambient temperature range of -40°C to +140°C.
The specifications between -40°C to +140°C are identical to those shown in Section 28.0 “Electrical Characteristics”
for operation between -40°C to +125°C, with the exception of the parameters listed in this section.
Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in
Section 28.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10.
Absolute maximum ratings for the PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 and PIC24HJ128GPX02/X04 high
temperature devices are listed below. Exposure to these maximum rating conditions for extended periods can affect
device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in
the operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on any pin that is not 5V tolerant with respect to V
Voltage on any 5V tolerant pin with respect to V
Voltage on any 5V tolerant pin with respect to V
Voltage on V
Maximum current out of V
Maximum current into V
Maximum junction temperature............................................................................................................................. +145°C
Maximum output current sunk by any I/O pin
Maximum output current sourced by any I/O pin
Maximum current sunk by all ports combined ........................................................................................................10 mA
Maximum current sourced by all ports combined
© 2009 Microchip Technology Inc.
Note:
Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the
2: Maximum allowable current is a function of device maximum power dissipation (see Table 29-2).
3: Unlike devices at 125°C and below, the specifications in this section also apply to the CLKOUT, V
4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which
5: Refer to the “Pin Diagrams” section for 5V tolerant pins.
HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS
Programming of the Flash memory is not allowed above 125°C.
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods can affect device reliability.
V
the total operating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior
written approval from Microchip Technology Inc.
DD
CAP
REF
with respect to V
/V
-, SCLx, SDAx, PGCx and PGDx pins.
DDCORE
DD
SS
with respect to V
pin
pin .............................................................................................................................60 mA
(2)
(4)
.............................................................................................................................60 mA
SS
.........................................................................................................-40°C to +140°C
(1)
......................................................................................................... -0.3V to +4.0V
SS
(3)
....................................................................................... 2.25V to 2.75V
........................................................................................................1 mA
SS
SS
(3)
(2)
...................................................................................................1 mA
when V
when V
................................................................................................10 mA
Preliminary
SS
DD
DD
(5)
< 3.0V
.................................................... -0.3V to (V
3.0V
(5)
(5)
....................................... -0.3V to (V
.................................................... -0.3V to 5.6V
DS70293D-page 323
DD
DD
+ 0.3V)
+ 0.3V)
REF
+,

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