PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 324

• Manufacturer Part Number: PIC24HJ64GP502-E/MM
• Description: IC PIC MCU FLASH 64K 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit or 10-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

29.1
TABLE 29-1:
TABLE 29-2:
TABLE 29-3:
TABLE 29-4:
DS70293D-page 324
High Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
DC CHARACTERISTICS
Operating Voltage
HDC10
DC CHARACTERISTICS
Power-Down Current (I
HDC60e
HDC61c
Note 1:
Parameter
Parameter
Characteristic
No.
No.
2:
3:
4:
Operating Junction Temperature Range
I/O =
High Temperature DC Characteristics
P
Operating Ambient Temperature Range
INT
Base I
pulled to V
The
added to the base I
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
Supply Voltage
V
= V
Symbol
DD
({V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
current is the additional current consumed when the module is enabled. This current should be
Typical
DD
250
x (I
is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
3
SS
- V
DD
. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
PD
OH
-
)
} x I
Characteristic
I
Rating
OH
PD
3.0V to 3.6V
V
OH
2000
(in Volts)
Max
DD
)
current.
5
—
) +
Range
(V
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
x I
Units
OL
A
A
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
)
Preliminary
Min
3.0
Temperature Range
+140°C
+140°C
-40°C to +140°C
Typ
3.3
(in °C)
-40°C T
Symbol
P
DMAX
Max
3.3V
3.3V
P
T
T
3.6
A
D
J
-40°C T
A
Units
Conditions
Min
+140°C for High Temperature
Base Power-Down Current
Watchdog Timer Current: I
-40
-40
PD
V
A
)
PIC24HJ64GPX02/X04 and
(T
+140°C for High Temperature
PIC24HJ128GPX02/X04
P
© 2009 Microchip Technology Inc.
PIC24HJ32GP302/304,
INT
J
-40°C to +140°C
- T
Typ
—
—
+ P
A
)/
Max MIPS
I
/
JA
O
Conditions
20
+145
+140
Max
(1,3)
WDT (2,4)
Unit
°C
°C
W
W