PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 306

IC PIC MCU FLASH 64K 28-QFN

PIC24HJ64GP502-E/MM

Manufacturer Part Number
PIC24HJ64GP502-E/MM
Description
IC PIC MCU FLASH 64K 28-QFN
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

Program Memory Type
FLASH
Program Memory Size
64KB (22K x 24)
Package / Case
28-QFN
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit or 10-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
TABLE 28-31: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70293D-page 306
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
SP60
Note 1:
Param
No.
2:
3:
4:
TscL
TscH
TssL2doV SDOx Data Output Valid after
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ SSx
TscH2ssH
TscL2ssH
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx
Input
High-Impedance
SSx
SSx Edge
SDOx Data Output Rise Time
to SCKx
to SDO
after SCKx Edge
Characteristic
X
Output
(4)
or SCKx
(3)
(3)
(1)
(3)
Preliminary
(3)
1.5 T
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
120
CY
30
30
20
20
10
+ 40
Typ
10
10
(2)
Max
25
25
30
50
50
-40°C
-40°C
© 2009 Microchip Technology Inc.
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
T
T
A
A
+125°C for Extended
+85°C for Industrial
See Note 3
See Note 3
See parameter D032
and Note 3
See parameter D031
and Note 3
See Note 4
Conditions

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