ST10F269Z2Q3 STMicroelectronics, ST10F269Z2Q3 Datasheet - Page 151

• Manufacturer Part Number: ST10F269Z2Q3
• Description: IC FLASH MEM 256KBIT 144-PQFP
• Manufacturer: STMicroelectronics
• Series: ST10r

Specifications of ST10F269Z2Q3

• Core Processor: ST10
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SSC, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 111
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-QFP
• Processor Series: ST10F26x
• Core: ST10
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN, SSC, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 111
• Number Of Timers: 2 x 16 bit
• Operating Supply Voltage: 0.3 V to 4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit x 10 bit
• Cpu Family: ST10
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 12KB
• # I/os (max): 111
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Instruction Set Architecture: CISC/RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2042

ST10F269
V
1. Theoretical minimum. The real minimum value depends on the duty cycle of the input clock signal. 32MHz is the maximum input frequency
when using an external crystal oscillator. However, 32MHz can be applied with an external clock source.
2. The input clock signal must reach the defined levels V
Figure 70 : External Clock Drive XTAL1
21.4.9 - Memory Cycle Variables
The tables below use three variables which are derived from the BUSCONx registers and represent the
special characteristics of the programmed memory cycle. The following table describes, how these
variables are to be computed.
Oscillator period
High time
Low time
Rise time
Fall time
ALE Extension
Memory Cycle Time wait states
Memory Tri-state Time
DD
= 5V
Parameter
10%, V
Description
SS
t
t
t
t
t
= 0V, T
OSC
1
2
3
4
Symbol
SR
SR
SR
SR
SR
A
= -40 to +125 °C (TQFP144 devices)
t
Minimum
1
31.25
12.5
12.5
–
–
f
CPU
2
2
1
= f
IL
Symbol
Maximum
and V
XTAL
V
3.125
3.125
IH2
t
t
t
A
C
F
–
–
–
IH2
2
2
t
.
2
t
3
Minimum
15.625
TCL x [ALECTL]
2TCL x (15 - [MCTC])
2TCL x (1 - [MTTC])
6.25
6.25
f
CPU
–
–
t
2
2
OSC
V
= f
IL
XTAL
Maximum Minimum Maximum
1.56
1.56
/ 2
–
–
–
2
2
Values
31.25 x N
F = 1.5/2,/2.5/3/4/5
12.5
12.5
f
CPU
–
–
2
2
= f
t
4
XTAL
3.125
3.125
x F
–
–
–
2
2
151/184
Unit
ns
ns
ns
ns
ns