MC9S12C32CFAE25 Freescale Semiconductor, MC9S12C32CFAE25 Datasheet - Page 682

• Manufacturer Part Number: MC9S12C32CFAE25
• Description: IC MCU 32K FLASH 25MHZ 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12C32CFAE25

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: S12C
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 31
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912C32EE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• For Use With: CML12C32SLK - KIT STUDENT LEARNING 16BIT HCS12
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix C Package Information
C.1.1
682
SEATING
PLANE
DATUM
PLANE
-C-
L
-A-
C
-H-
80-Pin QFP Package
E
H
61
80
60
DETAIL C
1
Figure C-1. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
G
0.20
0.05 A-B
0.20
W
M
M
X
H
C
K
A
S
L
A-B
A-B
DETAIL A
U
MC9S12C-Family / MC9S12GC-Family
R
-D-
T
S
S
D
D
Q
S
S
M
M
20
NOTES:
1.
2.
3.
4.
5.
6.
7.
Rev 01.24
41
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
40
21
-B-
B
DETAIL C
-H-
0.10
DATUM
PLANE
V
J
0.20
SECTION B-B
VIEW ROTATED 90
DETAIL A
Freescale Semiconductor
B
B
M
C
DIM
M
W
F
D
A
B
C
D
E
F
G
H
K
L
N
P
Q
R
S
T
U
V
X
J
A-B
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
0.65 BSC
5
0
0
---
1.6 REF
°
°
°
S
°
-A-,-B-,-D-
14.10
14.10
17.45
17.45
N
MAX
D
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
P
10
7
---
---
°
°
S