AT91SAM9M10-CU Atmel, AT91SAM9M10-CU Datasheet - Page 412
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AT91SAM9M10-CU
Manufacturer Part Number
AT91SAM9M10-CU
Description
IC MCU 16/32BIT ARM9 324TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Specifications of AT91SAM9M10-CU
Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
133 MHz
Number Of Programmable I/os
5
Number Of Timers
2 x 16 bit
Operating Supply Voltage
1.65 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9M10-G45-EK
Controller Family/series
AT91
No. Of I/o's
160
Ram Memory Size
64KB
Cpu Speed
400MHz
No. Of Timers
2
Rohs Compliant
Yes
Cpu Family
AT91
Device Core
ARM926EJ-S
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
64KB
# I/os (max)
160
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
1.8/2.5/3.3V
Operating Supply Voltage (max)
1.1/1.95/3.6V
Operating Supply Voltage (min)
0.9/1.65/1.8/3V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Package Type
TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT91SAM9M10-CU
Manufacturer:
Atmel
Quantity:
996
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28.7.3.10
28.7.3.11
28.7.3.12
412
AT91SAM9M10
Peripheral Deselection without PDCDMAC
Peripheral Deselection with PDC
Peripheral Deselection with DMAC
During a transfer of more than one data on a Chip Select without the PDCDMAC, the SPI_TDR
is loaded by the processor, the flag TDRE rises as soon as the content of the SPI_TDR is trans-
ferred into the internal shift register. When this flag is detected high, the SPI_TDR can be
reloaded. If this reload by the processor occurs before the end of the current transfer and if the
next transfer is performed on the same chip select as the current transfer, the Chip Select is not
de-asserted between the two transfers. But depending on the application software handling the
SPI status register flags (by interrupt or polling method) or servicing other interrupts or other
tasks, the processor may not reload the SPI_TDR in time to keep the chip select active (low). A
null Delay Between Consecutive Transfer (DLYBCT) value in the SPI_CSR register, will give
even less time for the processor to reload the SPI_TDR. With some SPI slave peripherals,
requiring the chip select line to remain active (low) during a full set of transfers might lead to
communication errors.
To facilitate interfacing with such devices, the Chip Select Register [CSR0...CSR3] can be pro-
grammed with the CSAAT bit (Chip Select Active After Transfer) at 1. This allows the chip select
lines to remain in their current state (low = active) until transfer to another chip select is required.
Even if the SPI_TDR is not reloaded the chip select will remain active. To have the chip select
line to raise at the end of the transfer the Last transfer Bit (LASTXFER) in the SPI_MR register
must be set at 1 before writing the last data to transmit into the SPI_TDR.
When the Peripheral DMA Controller is used, the chip select line will remain low during the
whole transfer since the TDRE flag is managed by the PDC itself. The reloading of the SPI_TDR
by the PDC is done as soon as TDRE flag is set to one. In this case the use of CSAAT bit might
not be needed. However, it may happen that when other PDC channels connected to other
peripherals are in use as well, the SPI PDC might be delayed by another (PDC with a higher pri-
ority on the bus). Having PDC buffers in slower memories like flash memory or SDRAM
compared to fast internal SRAM, may lengthen the reload time of the SPI_TDR by the PDC as
well. This means that the SPI_TDR might not be reloaded in time to keep the chip select line
low. In this case the chip select line may toggle between data transfer and according to some
SPI Slave devices, the communication might get lost. The use of the CSAAT bit might be
needed.
When the Direct Memory Access Controller is used, the chip select line will remain low during
the whole transfer since the TDRE flag is managed by the DMAC itself. The reloading of the
SPI_TDR by the DMAC is done as soon as TDRE flag is set to one. In this case the use of
CSAAT bit might not be needed. However, it may happen that when other DMAC channels con-
nected to other peripherals are in use as well, the SPI DMAC might be delayed by another
(DMAC with a higher priority on the bus). Having DMAC buffers in slower memories like flash
memory or SDRAM compared to fast internal SRAM, may lengthen the reload time of the
SPI_TDR by the DMAC as well. This means that the SPI_TDR might not be reloaded in time to
keep the chip select line low. In this case the chip select line may toggle between data transfer
and according to some SPI Slave devices, the communication might get lost. The use of the
CSAAT bit might be needed.
Figure 28-12
shows different peripheral deselction cases and the effect of the CSAAT bit.
6355B–ATARM–21-Jun-10
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