ST72F325K4T6 STMicroelectronics, ST72F325K4T6 Datasheet - Page 172

MCU 8BIT 16KB FLASH/ROM 32-LQFP

ST72F325K4T6

Manufacturer Part Number
ST72F325K4T6
Description
MCU 8BIT 16KB FLASH/ROM 32-LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST72F325K4T6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
48
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7232X-EVAL, ST7232X-SK/RAIS, ST72325-D/RAIS, ST7MDT20-DVP3, ST7MDT20J-EMU3, ST7MDT20M-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-5605

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST72F325K4T6
Manufacturer:
ST
Quantity:
151
Part Number:
ST72F325K4T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST72F325K4T6
Manufacturer:
ST
0
Part Number:
ST72F325K4T6
Manufacturer:
ST
Quantity:
20 000
Part Number:
ST72F325K4T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST72F325K4T6TR
Manufacturer:
ST
0
ST72325xx
ADC CHARACTERISTICS (Cont’d)
12.12.1 Analog Power Supply and Reference
Pins
Depending on the MCU pin count, the package
may feature separate V
power supply pins. These pins supply power to the
A/D converter cell and function as the high and low
reference voltages for the conversion.
Separation of the digital and analog power pins al-
low board designers to improve A/D performance.
Conversion accuracy can be impacted by voltage
drops and noise in the event of heavily loaded or
badly decoupled power supply lines (see
12.12.2 General PCB Design
12.12.2 General PCB Design Guidelines
To obtain best results, some general design and
layout rules should be followed when designing
the application PCB to shield the noise-sensitive,
analog physical interface from noise-generating
CMOS logic signals.
– Use separate digital and analog planes. The an-
Figure 97. Power Supply Filtering
172/197
alog ground plane should be connected to the
digital ground plane via a single point on the
PCB.
POWER
SUPPLY
SOURCE
V
DD
AREF
1 to 10μF
Guidelines).
and V
ST7
DIGITAL NOISE
FILTERING
SSA
EXTERNAL
NOISE
FILTERING
Section
analog
0.1μF
0.1μF
– Filter power to the analog power planes. It is rec-
– The analog and digital power supplies should be
– Properly place components and route the signal
ommended to connect capacitors, with good high
frequency characteristics, between the power
and ground lines, placing 0.1µF and optionally, if
needed 10pF capacitors as close as possible to
the ST7 power supply pins and a 1 to 10µF ca-
pacitor close to the power source (see
97).
connected in a star network. Do not use a resis-
tor, as V
the A/D converter and any resistance would
cause a voltage drop and a loss of accuracy.
traces on the PCB to shield the analog inputs.
Analog signals paths should run over the analog
ground plane and be as short as possible. Isolate
analog signals from digital signals that may
switch while the analog inputs are being sampled
by the A/D converter. Do not toggle digital out-
puts on the same I/O port as the A/D input being
converted.
V
V
V
V
SS
DD
AREF
SSA
AREF
ST72XXX
is used as a reference voltage by
Figure

Related parts for ST72F325K4T6