ST72F325K4T6 STMicroelectronics, ST72F325K4T6 Datasheet - Page 179

MCU 8BIT 16KB FLASH/ROM 32-LQFP

ST72F325K4T6

Manufacturer Part Number
ST72F325K4T6
Description
MCU 8BIT 16KB FLASH/ROM 32-LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST72F325K4T6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
48
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7232X-EVAL, ST7232X-SK/RAIS, ST72325-D/RAIS, ST7MDT20-DVP3, ST7MDT20J-EMU3, ST7MDT20M-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-5605

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13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is
the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the applica-
tion.
Symbol
T
R
Jmax
P
thJA
D
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
1)
Ratings
2)
LQFP64 10x10
LQFP44 10x10
LQFP48 7x7
LQFP32 7x7
SDIP42
SDIP32
Value
150
500
50
80
52
55
70
50
ST72325xx
°C/W
Unit
mW
179/197
°C

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