PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 572

IC MCU FLASH 1KX14 18-DIP

PIC16F818-I/P

Manufacturer Part Number
PIC16F818-I/P
Description
IC MCU FLASH 1KX14 18-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F818-I/P

Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F818-I/P
Manufacturer:
Microchip Technology
Quantity:
295
PICmicro MID-RANGE MCU FAMILY
30.1
DS31030A-page 30-2
Introduction
This section is intended to show you the electrical specifications that may be specified in a par-
ticular device data sheet and what is meant by the specification. This section is NOT intended to
give the values of these specifications. For the device specific values you must refer to the
device’s data sheet. All values show in this section should be considered as Example Values.
In the description of the device and the functional modules (previous sections), there have been
references to electrical specification parameters. These references have been hyperlinked in the
electronic version to aid in the use of this manual.
Throughout this section, certain terms will be used.
be used.
Table 30-1:
Note: Before starting any design, Microchip HIGHLY recommends
PIC16CXXX
PIC16LCXXX
PIC16FXXX
PIC16LFXXX
PIC16CRXXX
PIC16LCRXXX
PIC16XXXX-04
PIC16XXXX-08
PIC16XXXX-10
PIC16XXXX-20
LP osc
XT osc
HS osc
RC osc
Commercial
Industrial
Extended
Term
that you acquire the most recent copy of the device data sheet
and review the electrical specifications to ensure that they will
meet your requirements.
Term Conventions
Description
For devices tested to standard voltage range
For devices tested to extended voltage range
For devices tested to standard voltage range
For devices tested to extended voltage range
For devices tested to standard voltage range
For devices tested to extended voltage range
For devices that have been tested up to 4 MHz operation
For devices that have been tested up to 8 MHz operation
For devices that have been tested up to 10 MHz operation
For devices that have been tested up to 20 MHz operation
For devices configured with the LP device oscillator selected
For devices configured with the XT device oscillator selected
For devices configured with the HS device oscillator selected
For devices configured with the RC device oscillator selected
For devices with the commercial temperature range grading
(0˚C
For devices with the industrial temperature range grading
(-40˚C
For devices with the extended temperature range grading
(-40˚C
T
A
T
T
A
A
+70˚C)
+85˚C)
+125˚C)
Table 30-1
shows the conventions that will
1997 Microchip Technology Inc.

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