PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 674
PIC16F818-I/P
Manufacturer Part Number
PIC16F818-I/P
Description
IC MCU FLASH 1KX14 18-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(176 pages)
4.PIC16F818-ISO.pdf
(6 pages)
5.PIC16F818-ISO.pdf
(8 pages)
6.PIC16F818-ISO.pdf
(8 pages)
Specifications of PIC16F818-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F818-I/P
Manufacturer:
Microchip Technology
Quantity:
295
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F818-ISO PDF datasheet #4
- PIC16F818-ISO PDF datasheet #5
- PIC16F818-ISO PDF datasheet #6
- Current page: 674 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
B
DS31035A-page 35-2
Bank
This is a method of addressing Data Memory. Since midrange devices have 7-bits for direct
addressing, instructions can address up to 128 bytes (including special function registers). To
allow more data memory to be present on a device, data memory is partitioned into contiguous
banks of 128 bytes each. To select the desired bank, the bank selection bits (RP1:RP0) need to
be appropriately configured. Since there are presently 2 bank selection bits, 4 banks can be
implemented.
Baud
Generally how the communication speed of serial ports is described. Equivalent to bits per sec-
ond (bps).
BCD
See Binary Coded Decimal.
Binary Coded Decimal (BCD)
Each 4-bit nibble expresses a digit from 0-9. Usually two digits are packed to a byte giving a
range of 0 - 99.
BOR
See Brown-out Reset.
Brown-out
A condition where the supply voltage of the device temporarily falls below the specified minimum
operation point. This can occur when a load is switched on and causes the system/device voltage
to drop.
Brown-out Reset (BOR)
Circuitry which will force the device to the reset state if the (device) voltage falls below a specified
voltage level. Some devices have an internal BOR circuit, while other devices would require an
external circuit to be created.
Bus width
This is the number of bits of information that the bus carries. For the Data Memory, the bus width
is 8-bits. For the midrange devices the Program Memory bus width is 14-bits.
1997 Microchip Technology Inc.
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