D12312SVF20V Renesas Electronics America, D12312SVF20V Datasheet - Page 725

IC H8S/2312S MCU ROMLESS 100QFP

D12312SVF20V

Manufacturer Part Number
D12312SVF20V
Description
IC H8S/2312S MCU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVF20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVF20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
17.22.5 Flash MAT Configuration
This LSI's flash memory is configured by the 512-kbyte user MAT and 8-kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes if it is in ROM valid mode. However,
the user boot MAT can be programmed only in boot mode and PROM mode.
The user MAT and user boot MAT have different memory sizes. Do not access a user boot MAT
that is 8 kbytes or more. When a user boot MAT exceeding 8 kbytes is read from, an undefined
value is read.
Address H'000000
Address H'07FFFF
Figure 17.62 Flash Memory Configuration
<User MAT>
512 kbytes
Address H'001FFF
Address H'000000
Rev.7.00 Feb. 14, 2007 page 691 of 1108
<User boot MAT>
REJ09B0089-0700
Section 17 ROM
8 kbytes

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