R4F24269NVFQV Renesas Electronics America, R4F24269NVFQV Datasheet - Page 331

MCU 256KB FLASH 64K 144-LQFP

R4F24269NVFQV

Manufacturer Part Number
R4F24269NVFQV
Description
MCU 256KB FLASH 64K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24269NVFQV

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24269NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
R4F24269NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2426, H8S/2426R, H8S/2424 Group
Setting the DRMI bit in DRACCR to 1 enables an idle cycle to be inserted in the case of
consecutive read and write operations in DRAM/continuous synchronous DRAM space burst
access. Figures 6.93 and 6.94 show an example of the timing for idle cycle insertion in the case of
consecutive read and write accesses to DRAM/continuous synchronous DRAM space.
REJ09B0466-0350 Rev. 3.50
Jul 09, 2010
Figure 6.93 Example of Timing for Idle Cycle Insertion in Case of Consecutive Read and
UCAS, LCAS
Address bus
Note: n = 2 to 5
RASn (CSn)
WE (HWR)
Data bus
OE (RD)
Write Accesses to DRAM Space in RAS Down Mode
φ
T
p
DRAM space read
T
r
T
c1
T
c2
Idle cycle
DRAM space write
T
i
T
c1
T
Section 6 Bus Controller (BSC)
c2
Page 301 of 1372

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