HD64F3067RF20 Renesas Electronics America, HD64F3067RF20 Datasheet - Page 21

• Manufacturer Part Number: HD64F3067RF20
• Description: IC H8 MCU FLASH 128K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3067RF20

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Package: 100PQFP
• Family Name: H8
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 70
• Interface Type: SCI
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 7
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 19 Clock Pulse Generator
19.1 Overview........................................................................................................................... 665
19.2 Oscillator Circuit............................................................................................................... 667
19.3 Duty Adjustment Circuit................................................................................................... 672
19.4 Prescalers .......................................................................................................................... 672
19.5 Frequency Divider ............................................................................................................ 672
Section 20 Power-Down State
20.1 Overview........................................................................................................................... 675
20.2 Register Configuration...................................................................................................... 677
20.3 Sleep Mode ....................................................................................................................... 683
20.4 Software Standby Mode.................................................................................................... 684
20.5 Hardware Standby Mode .................................................................................................. 689
20.6 Module Standby Function ................................................................................................. 691
20.7 System Clock Output Disabling Function......................................................................... 693
Section 21 Electrical Characteristics
21.1 Electrical Characteristics of Mask ROM Version ............................................................. 695
19.1.1 Block Diagram ..................................................................................................... 666
19.2.1 Connecting a Crystal Resonator........................................................................... 667
19.2.2 External Clock Input ............................................................................................ 669
19.5.1 Register Configuration......................................................................................... 672
19.5.2 Division Control Register (DIVCR) .................................................................... 673
19.5.3 Usage Notes ......................................................................................................... 673
20.2.1 System Control Register (SYSCR) ...................................................................... 677
20.2.2 Module Standby Control Register H (MSTCRH)................................................ 679
20.2.3 Module Standby Control Register L (MSTCRL)................................................. 680
20.3.1 Transition to Sleep Mode..................................................................................... 683
20.3.2 Exit from Sleep Mode.......................................................................................... 683
20.4.1 Transition to Software Standby Mode ................................................................. 684
20.4.2 Exit from Software Standby Mode ...................................................................... 684
20.4.3 Selection of Waiting Time for Exit from Software Standby Mode...................... 685
20.4.4 Sample Application of Software Standby Mode.................................................. 687
20.4.5 Note...................................................................................................................... 687
20.4.6 Cautions on Clearing the Software Standby Mode of F-ZTAT Version.............. 688
20.5.1 Transition to Hardware Standby Mode ................................................................ 689
20.5.2 Exit from Hardware Standby Mode ..................................................................... 689
20.5.3 Timing for Hardware Standby Mode ................................................................... 690
20.6.1 Module Standby Timing ...................................................................................... 691
20.6.2 Read/Write in Module Standby............................................................................ 691
20.6.3 Usage Notes ......................................................................................................... 691
......................................................................................... 675
.................................................................................. 665
.............................................................................. 695
Rev. 4.00 Jan 26, 2006 page xix of xxii