HD64F3067RF20 Renesas Electronics America, HD64F3067RF20 Datasheet - Page 736

• Manufacturer Part Number: HD64F3067RF20
• Description: IC H8 MCU FLASH 128K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3067RF20

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Package: 100PQFP
• Family Name: H8
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 70
• Interface Type: SCI
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 7
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
Item
SCI
DMAC TEND delay
Rev. 4.00 Jan 26, 2006 page 712 of 938
REJ09B0276-0400
Input
clock
cycle
Input clock rise
time
Input clock fall
time
Input clock
pulse width
Transmit data
delay time
Receive data
setup time
(synchronous)
Receive
data hold
time (syn-
chronous)
time 1
TEND delay
time 2
DREQ setup
time
DREQ hold
time
Asyn-
chronous
Syn-
chronous
Clock
input
Clock
output
Symbol Min
t
t
t
t
t
t
t
t
t
t
t
Scyc
SCKr
SCKf
SCKW
TXD
RXS
RXH
TED1
TED2
DRQS
DRQH
4
6
1.5
1.5
0.4
—
100
100
0
—
—
40
10
A
—
—
—
—
0.6
100
—
—
—
100
100
—
—
Max
Min
4
6
1.5
1.5
0.4
—
100
100
0
—
—
40
10
Condition
B
Max
—
—
—
—
0.6
100
—
—
—
100
100
—
—
Min
4
6
1.5
1.5
0.4
—
100
100
0
—
—
25
10
C
Max
—
—
—
—
0.6
100
—
—
—
50
50
—
—
Unit
t
t
t
t
t
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
cyc
cyc
Scyc
Test
Conditions
Figure 21.23
Figure 21.24
Figure 21.25,
figure 21.26
Figure 21.27