DF61657CN35FTV Renesas Electronics America, DF61657CN35FTV Datasheet - Page 220

IC H8SX/1657 MCU FLASH 120TQFP

DF61657CN35FTV

Manufacturer Part Number
DF61657CN35FTV
Description
IC H8SX/1657 MCU FLASH 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of DF61657CN35FTV

Core Processor
H8SX
Core Size
32-Bit
Speed
35MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
82
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
For Use With
3DK1657 - DEV EVAL KIT FOR H8SX/1657
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF61657CN35FTV
Manufacturer:
RENESAS
Quantity:
101
Part Number:
DF61657CN35FTV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller (BSC)
6.7.6
When the byte control SRAM space is specified, the RDNCR setting for the corresponding space
is invalid.
The read strobe negation timing is the same timing as when RDNn = 1 in the basic bus interface.
Note that the RD timing with respect to the DACK rising edge becomes different.
6.7.7
In the byte control SRAM interface, the extension cycles can be inserted before and after the bus
cycle in the same way as the basic bus interface. For details, refer to section 6.6.6, Extension of
Chip Select (CS) Assertion Period.
Rev. 2.00 Jun. 28, 2007 Page 194 of 864
REJ09B0341-0200
Read Strobe (RD)
Extension of Chip Select (CS) Assertion Period

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