UPD78F0551MA-FAA-AX Renesas Electronics America, UPD78F0551MA-FAA-AX Datasheet - Page 791

• Manufacturer Part Number: UPD78F0551MA-FAA-AX
• Description: MCU 8BIT 16-SSOP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx2-Lr

Specifications of UPD78F0551MA-FAA-AX

• Core Processor: 78K/0
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I²C, LIN, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 9
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

<R>
<R>
<R>
78K0/Kx2-L
sales representative.
Note
Cautions 1.
R01UH0028EJ0400 Rev.4.00
Sep 27, 2010
Infrared reflow
Partial heating
Infrared reflow
Soldering Method
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
(1) 78K0/KY2-L, 78K0/KA2-L (20-pin products), 78K0/KB2-L, 78K0/KC2-L (44-pin and 48-pin products)
(2) 78K0/KA2-L (25-pin and 32-pin products), 78K0/KC2-L (40-pin products)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
2.
3.
Do not use different soldering methods together (except for partial heating).
The 78K0/Kx2-L microcontrollers have an on-chip debug function, which is provided for
development and evaluation. Do not use the on-chip debug function in products designated for
mass production, because the guaranteed number of rewritable times of the flash memory may be
exceeded when this function is used, and product reliability therefore cannot be guaranteed.
Renesas Electronics is not liable for problems occurring when the on-chip debug function is used.
Solder the exposed pad of a 32 or 40-pin plastic WQFN package, and set the potential to the same
value as V
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
SS
.
Table 30-1. Surface Mounting Type Soldering Conditions
32-PIN PLASTIC WQFN
Soldering Conditions
Soldering Conditions
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
Exposed pad
Note
Note
(after that, prebake at 125°C for
(after that, prebake at 125°C for
40-PIN PLASTIC WQFN
IR60-107-3
IR60-107-3
Condition Symbol
Condition Symbol
Recommended
Recommended
−
777