UPD78F0551MA-FAA-AX Renesas Electronics America, UPD78F0551MA-FAA-AX Datasheet - Page 819

• Manufacturer Part Number: UPD78F0551MA-FAA-AX
• Description: MCU 8BIT 16-SSOP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx2-Lr

Specifications of UPD78F0551MA-FAA-AX

• Core Processor: 78K/0
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I²C, LIN, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 9
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

78K0/Kx2-L
R01UH0028EJ0400 Rev.4.00
Sep 27, 2010
3rd Edition
Remark “Classification” in the above table classifies revisions as follows.
Edition
(a): Error correction, (b): Addition/change of specifications, (c): Addition/change of description or note, (d):
Addition/change of package, part number, or management division, (e): Addition/change of related
documents
Modification of Figure 21-2 Timing of Generation of Internal Reset Signal by Power-
on-Clear Circuit and Low-Voltage Detector
Modification of 23.1 Regulator Overview
Addition of 23.3 Cautions for Self Programming
Modification of Figure 25-2 Environment for Writing Program to Flash Memory
Modification of Table 25-2 Pin Connection
Modification of 25.4.1 TOOL pins
Addition of 25.4.7 On-board writing when connecting crystal/ceramic resonator
Modification of 25.5.2 Flash memory programming mode
Addition of 25.7 Processing Time for Each Command When PG-FP5 Is Used
(Reference)
Modification of Cautions 3 to 5 and Remark in 25.8 Flash Memory Programming by
Self Programming
Addition of 25.8.1 Register controlling self programming mode and 25.8.2 Flow of
self programming (Rewriting Flash Memory)
Modification of Caution in 25.8.3 Boot swap function
Addition of 25.9 Creating ROM Code to Place Order for Previously Written Product
Modification of Figure 26-1 Connection Example of QB-MINI2 and 78K0/Kx2-L
Microcontrollers
Modification of 26.2 On-Chip Debug Security ID
Addition of 26.3 Securing of User Resources
Revision of chapter
Modification of Table 30-1 Surface Mounting Type Soldering Conditions
Under development → Under mass production
• QB-78K0KX2-L
Modification of Notes 3 and 4 in Figure A-1 Development Tool Configuration (1/2)
Modification of Note 5 in Figure A-1 Development Tool Configuration (2/2)
Addition of Note 1 to A.3.1 When using flash memory programmer PG-FP5 and FL-
PR5
Addition of the product name of system simulator to A.5 Debugging Tools (Software)
Addition of C.2 Revision History of Preceding Editions
Description
APPENDIX C REVISION HISTORY
CHAPTER 21
POWER-ON-CLEAR
CIRCUIT
CHAPTER 23
REGULATOR
CHAPTER 25 FLASH
MEMORY
CHAPTER 26 ON-
CHIP DEBUG
FUNCTION
CHAPTER 28
ELECTRICAL
SPECIFICATIONS
CHAPTER 30
RECOMMENDED
SOLDERING
CONDITIONS
APPENDIX A
DEVELOPMENT
TOOLS
APPENDIX C
REVISION HISTORY
Chapter
(8/8)
805