HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 606

IC H8 MCU FLASH 128K 100QFP

HD64F3048BF25

Manufacturer Part Number
HD64F3048BF25
Description
IC H8 MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3048BF25

Core Processor
H8/300H
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3048BF25
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F3048BF25V
Manufacturer:
RENESAS/PBF
Quantity:
2 631
Part Number:
HD64F3048BF25V
Manufacturer:
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
State transitions between the normal user mode and on-board programming mode are performed
by changing the FWE pin level from high to low or from low to high. To prevent misoperation
(erroneous programming or erasing) in these cases, the bits in the flash memory control registers
(FLMCR1 and FLMCR2) should be cleared to 0 before making such a transition. After the bits are
cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is
insufficient.
Rev. 3.00 Sep 27, 2006 page 578 of 872
REJ09B0325-0300

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