HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 96

IC H8 MCU FLASH 128K 100QFP

HD64F3048BF25

Manufacturer Part Number
HD64F3048BF25
Description
IC H8 MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3048BF25

Core Processor
H8/300H
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 2 CPU
2.9.3
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the register being accessed. Figure 2.17 shows the on-chip supporting module access
timing. Figure 2.18 indicates the pin states.
Rev. 3.00 Sep 27, 2006 page 68 of 872
REJ09B0325-0300
Read
access
Write
access
On-Chip Supporting Module Access Timing
Address bus
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Address bus
AS
D
15
Figure 2.17 Access Cycle for On-Chip Supporting Modules
,
to D
RD HWR LWR
Figure 2.16 Pin States during On-Chip Memory Access
,
0
,
High
T state
1
T
1
High-impedance
Address
Bus cycle
Address
T state
2
Read data
Write data
T
2
T state
3

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