MCF5272CVF66 Freescale Semiconductor, MCF5272CVF66 Datasheet - Page 295

• Manufacturer Part Number: MCF5272CVF66
• Description: IC MPU 32BIT 66MHZ 196-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5272CVF66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• Ram Size: 1K x 32
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 196-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Not Compliant

12.5.3
Figure 12-25
Freescale Semiconductor
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Bypass capacitors should be connected between the Vdd and GND pairs with minimal trace length.
These capacitors help supply the instantaneous currents of the digital circuitry, in addition to
decoupling the noise that may be generated by other sections of the device or other circuitry on the
power supply.
Use short, wide, low inductance traces to connect all of the GND pins together and, with a single
trace, connect all of the GND pins to the power supply ground. This helps to reduce voltage spikes
in the ground circuit caused by high-speed digital current spikes. Suppressing these voltage spikes
on the integrated circuit is the reason for multiple GND leads. A PCB with a ground plane
connecting all of the digital and analog GND pins together is the optimal ground configuration,
producing the lowest resistance and inductance in the ground circuit.
Use short, wide, low inductance traces to connect all of the Vdd power supply pins together and,
with a single trace, connect all of the Vdd pins to the 3.3V power supply. Connecting all of the
digital and analog Vdd pins to the power plane would be the optimal power distribution method for
a multi-layer PCB with a power plane.
The 48-MHz oscillator must be located as close as possible to the chip package. This is required to
minimize parasitic capacitance between crystal traces and ground.
Recommended USB Protection Circuit
shows the recommended external ESD protection circuit for the USB.
D +
D –
MCF5272 ColdFire
+3.3V
22pF
+3.3V
2 x MMBD301LT1
Figure 12-25. USB Protection Circuit
Schottky Diode
®
Integrated Microprocessor User’s Manual, Rev. 3
22pF
33
33
BZX84C3V3LT1
Zener Diode
1.5K
0.1μF
330
USB Port
1
2
3
4
Universal Serial Bus (USB)
12-37