MT47H256M8EB-25E:C Micron Technology Inc, MT47H256M8EB-25E:C Datasheet - Page 2
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT47H256M8EB-25E:C
Manufacturer Part Number
MT47H256M8EB-25E:C
Description
256MX8 DDR2 SDRAM PLASTIC GREEN FBGA 1.8V
Manufacturer
Micron Technology Inc
Series
-r
Datasheet
1.MT47H256M8EB-25EC.pdf
(134 pages)
Specifications of MT47H256M8EB-25E:C
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
2G (256M x 8)
Speed
2.5ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-TFBGA
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
ATT
Quantity:
400
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
MICRON
Quantity:
12 208
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
MICRON
Quantity:
12 208
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
BGA
Quantity:
11 350
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
MICRON
Quantity:
20 000
Table 1: Key Timing Parameters
Table 2: Addressing
Part Numbers
Figure 1: 2Gb DDR2 Part Numbers
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Note:
Speed Grade
-187E
-25E
-37E
-25
-3E
-5E
-3
1. Not all speeds and configurations are available.
Package
CL = 3
84-Ball 11.5mm x 14mm FBGA
60-Ball 11.5mm x 14mm FBGA
84-Ball 9.0mm x 12.5mm FBGA
60-Ball 9.0mm x 11.5mm FBGA
84-Ball 9.0mm x 12.5mm FBGA (lead solder)
400
400
400
400
n/a
n/a
n/a
64 Meg x 4 x 8 banks
Configuration
MT47H
128 Meg x 16
512 Meg x 4
256 Meg x 8
A[11, 9:0] (2K)
512 Meg x 4
A[14:0] (32K)
Example Part Number: MT47H256M8HG-25
BA[2:0] (8)
8K
128M16
512M4
256M8
Configuration
CL = 4
533
533
667
533
533
400
n/a
Data Rate (MHz)
Package
CL = 5
2
HG
HG
RT
EB
PK
667
800
667
667
667
n/a
n/a
32 Meg x 8 x 8 banks
-
256 Meg x 8
A[14:0] (32K)
-187E
Speed
-25E
-37E
A[9:0] (1K)
BA[2:0] (8)
-25
-3E
-5E
-3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Power
Standard
8K
t CK = 1.875ns, CL = 7
t CK = 2.5ns, CL = 5
t CK = 2.5ns, CL = 6
t CK = 3ns, CL = 4
t CK = 3ns, CL = 5
t CK = 3.75ns, CL = 4
t CK = 5ns, CL = 3
Speed Grade
CL = 6
IT
2Gb: x4, x8, x16 DDR2 SDRAM
800
800
800
n/a
n/a
n/a
n/a
Industrial Temperature
:A/:C
Revision
:
Blank
Revision
© 2006 Micron Technology, Inc. All rights reserved.
16 Meg x 16 x 8 banks
CL = 7
1066
n/a
n/a
n/a
n/a
n/a
n/a
128 Meg x 16
A[13:0] (16K)
BA[2:0] (8)
A[9:0] (1K)
8K
Features
t
RC (ns)
54
55
55
54
55
55
55