PIC16F724-E/MV Microchip Technology, PIC16F724-E/MV Datasheet - Page 220

• Manufacturer Part Number: PIC16F724-E/MV
• Description: 7KB Flash Program, 1.8V-5.5V, 16MHz Internal Oscillator, 8b ADC, CCP, I2C/SPI, A
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F724-E/MV

• Processor Series: PIC16F
• Core: PIC
• Program Memory Type: Flash
• Program Memory Size: 7 KB
• Data Ram Size: 192 B
• Interface Type: I2C, SPI, AUSART
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: UQFN-40
• Development Tools By Supplier: MPLAB IDE Software
• Minimum Operating Temperature: - 40 C
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 36
• Eeprom Size: -
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 14x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / Rohs Status: Details

PIC16F72X/PIC16LF72X
23.5
DS41341E-page 220
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
P
= Junction Temperature
θ
θ
JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
≤ +125°C
Typ.
27.5
27.5
47.2
24.4
31.4
24.7
14.5
150
60
80
90
46
24
24
24
24
20
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
© 2009 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + Σ (I
- T
DD
I
/
O
A
(1)
)/θ
OH
JA
(2)
* (V
DD
- V
OH
))