SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 975

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SAM9G45

Manufacturer Part Number
SAM9G45
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G45

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
Figure 41-13. Multi-buffer Transfer with Source Address Auto-reloaded and Contiguous Destination Address
6438G–ATARM–19-Apr-11
Address of
Source Layer
The transfer is similar to that shown in
The DMAC Transfer flow is shown in
b. If the buffer complete interrupt is masked (DMAC_EBCIMR.BTC[x] = ‘1’, where x is
SADDR
automatic transfer mode bit should remain enabled to keep the DMAC in Row 11 as
shown in
the channel number) then hardware does not stall until it detects a write to the buf-
fer transfer completed interrupt enable register but starts the next buffer transfer
immediately. In this case software must clear the automatic mode bit,
DMAC_CTRLBx.AUTO, to put the device into ROW 1 of
before the last buffer of the DMAC transfer has completed.
Source Buffers
Table 41-2 on page
Figure 41-14 on page
Buffer0
Buffer2
Buffer1
Figure 41-13 on page
960.
Destination Buffers
DADDR(0)
DADDR(1)
DADDR(2)
Destination Layer
976.
Address of
975.
Table 41-2 on page 960
SAM9G45
975

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