LPC1850FET256 NXP Semiconductors, LPC1850FET256 Datasheet - Page 139

The LPC1850FET256 is a high-performance, cost-effective Cortex-M3 microcontroller featuring 200 kB of SRAM, and advanced peripherals including Ethernet, High Speed USB 2

LPC1850FET256

Manufacturer Part Number
LPC1850FET256
Description
The LPC1850FET256 is a high-performance, cost-effective Cortex-M3 microcontroller featuring 200 kB of SRAM, and advanced peripherals including Ethernet, High Speed USB 2
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
LPC1850_30_20_10
Preliminary data sheet
Fig 50. Reflow soldering of the LQFP144 package
Footprint information for reflow soldering of LQFP144 package
DIMENSIONS in mm
0.500
P1
0.560
P2
23.300 23.300 20.300 20.300
Hy
solder land
occupied area
Ax
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 3.1 — 15 December 2011
0.280
Generic footprint pattern
D1
0.400 20.500 20.500 23.550 23.550
P1
D2
Gx
Hx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M3 microcontroller
Hx
D1
LPC1850/30/20/10
Hy
By
© NXP B.V. 2011. All rights reserved.
Ay
sot486-1_fr
SOT486-1
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