mcf5274l Freescale Semiconductor, Inc, mcf5274l Datasheet - Page 48

• Manufacturer Part Number: mcf5274l
• Description: Mcf5275 Integrated Microprocessor Family Hardware
• Manufacturer: Freescale Semiconductor, Inc

Preliminary Electrical Characteristics
10.2 Thermal Characteristics
Table 44
48
NOTES:
1
2
3
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
T
Motorola recommends the use of T
junction temperatures from exceeding the rated specification. System designers should be aware that device
junction temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the
device junction temperature specification can be verified by physical measurement in the customer’s system using
the <
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
JMA
NOTES:
1
2
3
4
5
lists thermal resistance values
Instantaneous Maximum Current
Single pin limit (applies to all pins)
Operating Temperature Range (Packaged)
Storage Temperature Range
and <
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum Ratings
are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond those
listed may affect device reliability or cause permanent damage to the device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use
the larger of the two values.
All functional non-supply pins are internally clamped to V
Power supply must maintain regulation within operating O V
operating maximum current conditions. If positive injection current (V
injection current may flow out of O V
regulation. Insure external O V
will be the greatest risk when the MCU is not consuming power (ex; no clock).Power supply must
maintain regulation within operating V
conditions.
jt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 1.1
Characteristic
Table 43. Absolute Maximum Ratings
JmA
Table 44. Thermal characteristics
DD
4, 5
and power dissipation specifications in the system design to prevent device
load will shunt current greater than maximum injection current. This
DD
DD
and could result in external power supply going out of
range during instantaneous and operating maximum current
256 MBGA
Four layer board (2s2p)
256 MBGA
Four layer board (2s2p)
256 MBGA
256 MBGA
Natural convection
256 MBGA
Preliminary
SS
(T
DD
and O V
L
T
T
I
range during instantaneous and
- T
stg
D
A
SS
H
)
or O V
DD
in
> O V
1, 2
.
Symbol
T
T
– 65 to 150
DD
T
T
<
– 40 to 85
JMA
JMA
T
JB
JC
DD
jt
j
).
25
) is greater than I
Value
26
105
15
10
Freescale Semiconductor
23
2
1,2
5
3
4
mA
qC
qC
DD
, the
qC / W
qC / W
qC / W
qC / W
qC / W
Unit
o
C