SPEAR-09-H022_06 STMICROELECTRONICS [STMicroelectronics], SPEAR-09-H022_06 Datasheet - Page 66

• Manufacturer Part Number: SPEAR-09-H022_06
• Description: SPEAr Head200 ARM 926, 200K customizable eASIC gates, large IP portfolio SoC
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Electrical characteristics
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Electrical characteristics
Absolute maximum ratings
This product contains devices to protect the inputs against damage due to high static
voltages; however it is advisable to take normal precaution to avoid application of any
voltage higher than the specified maximum rated voltages.
Table 16.
The average chip-junction temperature, Tj, can be calculated using the following equation:
where:
●
●
●
If P
And, solving first equations:
VDD SDR
VDD DDR
VDD RTC
VDD core
Vi USBds
VDD PLL
Vi SRAM
Vi USBrr
VDD I/O
Symbol
Vi DDR
Vi TTL
VHBM
VCDM
PORT
Vi AN
Tstg
T
Θ
P
–
–
Tj
A
D
JA
is the ambient temperature in °C
= P
is neglected, an approximate relationship between P
is the package Junction-to-Ambient thermal resistance, which is 34 °C/W
P
P
INT
PORT
INT
Absolute maximum rating values
Supply voltage core
Supply voltage I/O
Supply voltage PLL
Supply voltage SDRAM
Supply voltage DDR
Supply voltage RTC
Input voltage TTL (3.3 and 5 V tolerant)
Input voltage SDRAM
Input voltage DDR
Input voltage USB (Host and Device) data signal
interfaces
Input voltage USB reference resistor
Analog input voltage ADC
Junction temperature
Storage temperature
This device is compliant with Human Body Model JEDEC spec JESD22-A114C Class 2
This device is compliant with Charge Device Model JEDEC spec JESD22-C101C Class 2
is the chip internal power
+ P
is the power dissipation on Input and Output pins; user determined
PORT
K = P
Parameter
D
P
· (T
T
D
j
= K / (Tj + 273 °C)
= T
A
+ 273 °C) + Θ
A
+ (P
D
· Θ
JA
)
JA
x P
D
D
2
is:
-40 to 125
-55 to 150
Value
2.1
6.4
6.4
6.4
5.4
2.1
6.4
6.4
5.4
6.4
6.4
6.4
SPEAR-09-H022
Unit
°C
°C
V
V
V
V
V
V
V
V
V
V
V
V