SPEAR-09-H022_06 STMICROELECTRONICS [STMicroelectronics], SPEAR-09-H022_06 Datasheet - Page 69

• Manufacturer Part Number: SPEAR-09-H022_06
• Description: SPEAr Head200 ARM 926, 200K customizable eASIC gates, large IP portfolio SoC
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

SPEAR-09-H022
26
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 20. PBGA420 Mechanical Data & Package Dimensions
DIM.
ddd
eee
D1
A1
A2
A3
A4
E1
D
fff
A
b
E
e
F
MIN.
22.80
22.80
0.27
0.45
1.305
0.785
21.00
21.00
23.00
23.00
TYP.
mm
0.52
0.50
1.00
1.00
MAX.
23.20 0.8976 0.9055 0.9134
23.20 0.8976 0.9055 0.9134
1.81
0.55 0.0177 0.0197 0.0217
0.20
0.25
0.10
0.0106
MIN.
0.0514
0.0205
0.0309
0.8268
0.8268
0.0394
0.0394
inch
TYP.
0.0713
0.0079
0.0098
0.0039
MAX.
PBGA420 (23x23x1.81mm)
Ball Grid Array Package
MECHANICAL DATA
OUTLINE AND
Package information
7859856 A
®
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