S71WS256NC0BAWE32 SPANSION [SPANSION], S71WS256NC0BAWE32 Datasheet - Page 16

• Manufacturer Part Number: S71WS256NC0BAWE32
• Description: Stacked Multi-Chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

5
5.1
14
Connection Diagrams/Physical Dimensions
Special Handling Instructions for FBGA Packages
This section contains the I/O designations and package specifications for the S71WS-N.
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth-
ods. The package and/or data integrity may be compromised if the package body is exposed to
temperatures above 150° C for prolonged periods of time.
A d v a n c e
S71WS-Nx0 Based MCPs
I n f o r m a t i o n
S71WS-N_01_A4 September 15, 2005