S71WS256NC0BAWE32 SPANSION [SPANSION], S71WS256NC0BAWE32 Datasheet - Page 97

• Manufacturer Part Number: S71WS256NC0BAWE32
• Description: Stacked Multi-Chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

September 15, 2005 S71WS-N_01_A4
Addresses
2Dh
27h
28h
29h
2Ah
2Bh
2Ch
2Eh
2Fh
30h
31h
32h
33h
34h
35h
36h
37h
38h
39h
3Ah
3Bh
3Ch
A d v a n c e
007Dh (WS128N)
0019h (WS256N)
0018h (WS128N)
00FDh (WS256N)
0001h
0000h
0006h
0000h
0003h
0003h
0000h
0080h
0000h
0000h
0000h
0002h
0003h
0000h
0080h
0000h
0000h
0000h
0000h
0000h
Data
I n f o r m a t i o n
Table 15.5 Device Geometry Definition
S71WS-Nx0 Based MCPs
Device Size = 2
Flash Device Interface description (refer to CFI publication 100)
Max. number of bytes in multi-byte write = 2
(00h = not supported)
Number of Erase Block Regions within device
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
Erase Block Region 2 Information
Erase Block Region 3 Information
Erase Block Region 4 Information
N
byte
Description
N
95