S71WS256NC0BAWE32 SPANSION [SPANSION], S71WS256NC0BAWE32 Datasheet - Page 90

• Manufacturer Part Number: S71WS256NC0BAWE32
• Description: Stacked Multi-Chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

Note: Breakpoints in waveforms indicate that system may alternately read array data from the “non-busy bank” while
checking the status of the program or erase operation in the “busy” bank. The system should read status twice to ensure
valid information.
88
Addresses
AVD#
WE#
Data
OE#
CE#
t
WPH
Command Sequence
PA/SA
t
AS
Last Cycle in
Sector Erase
Program or
t
Write Cycle
t
PD/30h
WP
t
t
AH
DS
Figure 14.24 Back-to-Back Read/Write Cycle Timings
t
t
t
OEH
DH
OE
t
RA
SR/W
t
Read status (at least two cycles) in same bank
A d v a n c e
ACC
t
S71WS-Nx0 Based MCPs
Read Cycle
and/or array data from other bank
RD
t
OEZ
I n f o r m a t i o n
t
OEH
RA
t
Read Cycle
RD
S71WS-N_01_A4 September 15, 2005
t
command sequence
GHWL
write or program
Begin another
555h
t
Write Cycle
AAh