LE80538NE0361MES L9LF Intel, LE80538NE0361MES L9LF Datasheet - Page 49

• Manufacturer Part Number: LE80538NE0361MES L9LF
• Description: MPU 400 RISC 32-Bit 65nm 1.86GHz 479-Pin BGA
• Manufacturer: Intel

283654-003
Table 28. Socketable Micro-PGA2 Package Specification
A
A
A
B
D
D
D
E
E
E
e
—
N
S
S
P
W
1
2
2
1
2
1
1
2
DIE
Symbol
Pin Tip Radial True Position
Overall Height, top of die to seating plane of interposer
Pin Length
Die Height
Pin Diameter
Package Width
Die Substrate Width
Die Width
Package Length
Die Substrate Length
Die Length
Pin Pitch
Pin Count
Outer Pin Center to Short Edge of Substrate
Outer Pin Center to Long Edge of Substrate
Allowable Pressure on the Die for Thermal Solution
Package Weight
Mobile Intel
®
Celeron
Datasheet
Parameter
®
Processor (0.18µ) in BGA2 and Micro-PGA2 Packages
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
27.05
30.85
3.13
Min
—
0.854 REF
28.27 REF
34.21 REF
2.144 REF
1.206 REF
1.25 REF
0.30 REF
0.127 REF
6.2 REF
1.27
495
27.35
31.15
Max
3.73
689
49
grams
each
Unit
kPa
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm