W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 4
![IC SPI FLASH 32MBIT 8SOIC](/photos/7/23/72379/8-soic__5_3mm_width___8-sop__8-soeiaj_sml.jpg)
W25Q32BVSSIG
Manufacturer Part Number
W25Q32BVSSIG
Description
IC SPI FLASH 32MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q32BVZPIG.pdf
(79 pages)
Specifications of W25Q32BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
Winbond
Quantity:
1 000
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
WINBOND
Quantity:
9 310
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
Winbond
Quantity:
6 600
Part Number:
W25Q32BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
8.
9.
10.
11.
ELECTRICAL CHARACTERISTICS ............................................................................................... 63
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
PACKAGE SPECIFICATION .......................................................................................................... 70
9.1
9.2
9.3
9.4
9.5
9.6
ORDERING INFORMATION .......................................................................................................... 77
10.1
REVISION HISTORY ...................................................................................................................... 79
7.2.38
7.2.39
Absolute Maximum Ratings ................................................................................................ 63
Operating Ranges............................................................................................................... 63
Power-up Timing and Write Inhibit Threshold .................................................................... 64
DC Electrical Characteristics .............................................................................................. 65
AC Measurement Conditions .............................................................................................. 66
AC Electrical Characteristics .............................................................................................. 67
AC Electrical Characteristics (cont’d) ................................................................................. 68
Serial Output Timing ........................................................................................................... 69
Serial Input Timing .............................................................................................................. 69
/HOLD Timing ..................................................................................................................... 69
/WP Timing ......................................................................................................................... 69
8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 70
8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71
8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72
8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74
16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75
24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76
Valid Part Numbers and Top Side Marking ........................................................................ 78
Program Security Registers (42h) ...................................................................................... 61
Read Security Registers (48h) ........................................................................................... 62
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W25Q32BV