W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 6

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q32BV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pad WSON 6x5-mm or 8x6-mm
(package code ZP & ZE), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1
3.2
Pin Configuration SOIC 208-mil
Pad Configuration WSON 6x5-mm / 8X6-mm
Figure 1b. W25Q32BV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP & ZE)
/WP (IO
DO (IO
Figure 1a. W25Q32BV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
GND
/WP (IO
/CS
DO (IO
1
2
)
)
GND
/CS
1
2
)
)
1
2
3
4
Top View
Top View
1
2
3
4
- 6 -
8
7
6
5
8
7
6
5
VCC
/HOLD (IO
CLK
DI (IO
VCC
/HOLD (IO
CLK
DI (IO
0
)
3
0
)
)
W25Q32BV
3
)