W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 52

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

7.2.31 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q32BV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
(IO
(IO
(IO
(IO
CLK
CLK
/CS
/CS
DO
DO
DI
DI
0
1
0
1
)
)
)
)
Mode 3
Mode 0
0
31
*
= MSB
32
33
Manufacturer ID (EFh)
0
34
Figure 29. Read Manufacturer / Device ID Diagram
1
35
Instruction (90h)
2
36
3
37
4
High Impedance
38
5
- 52 -
39
6
*
7
40
7
6
23
41
*
8
5
22
42
9
Device ID
Address (000000h)
4
21
43
10
3
44
2
45
3
28
1
46
2
29
0
1
W25Q32BV
30
0
Mode 3
Mode 0
31